Solder Ball
Todays deals on Solder Ball?
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10X NEW AMD RADEON IGP 216-0674022 BGA chipset With Lead free Solder Balls $1,199.95 |
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USED BIRD 5000 BGA REWORK REFLOW SOLDERING STATION FLUX STENCILS SOLDER BALLS $799.00 |
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10X NEW NVIDIA G92-700-A2 BGA chipset With Lead free Solder Balls $859.99 |
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10X NEW AMD RADEON IGP 216-0752001 BGA chipset With Lead free Solder Balls $799.95 |
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BGA rework station, LY IR6000,solder ball, solder paste, infrared bga station $550.00 |
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10X NEW NVIDIA G94-706-B1 BGA chipset With Lead free Solder Balls $699.95 |
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5X NEW AMD RADEON IGP 216-0674022 BGA chipset With Lead free Solder Balls $599.95 |
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10X NEW NVIDIA G84-600-A2 BGA chipset With Lead free Solder Balls $550.00 |
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10X NEW NVIDIA G84-602-A2 BGA Chipset With Lead Free Solder Balls $495.95 |
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10X NEW NVIDIA MCP89MZ-A3 With Lead free Solder Balls $465.00 |
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10X NEW NVIDIA NB9P-GS-W2-C1 BGA chipset With Lead Free Solder Balls $449.00 |
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5X NEW NVIDIA G92-700-A2 BGA chipset With Lead free Solder Balls $389.95 |
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5X NEW NVIDIA G94-706-B1 BGA chipset With Lead free Solder Balls $379.95 |
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10X NEW AMD 216-0810005 BGA chipset With Lead free Solder Balls $369.95 |
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10x NEW NVIDIA MCP89MZ-A2 With Lead free Solder Balls $369.95 |
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10x NEW NVIDIA MCP79MXT-B3 With Lead free Solder Balls $359.95 |
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Assorted Lead free ROHS Solder ball BGA SGS Certified $320.00 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball ROHS $320.00 |
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10X NEW NVIDIA MCP79MXD-B2 With Lead free Solder Balls $349.95 |
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Assorted Lead free ROHS Solder ball BGA SGS Certified $285.76 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball ROHS $285.76 |
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10pcs nVIDIA NF-G6150-N-A2 BGA North Bridge Chipset Lead free Solder Balls $312.00 |
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5X NEW AMD RADEON IGP 216-0752001 BGA chipset With Lead free Solder Balls $299.95 |
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5X NEW NVIDIA G86-770-A2 BGA chipset With Lead free Solder Balls $299.95 |
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10X NEW Intel BD82HM57 BGA Chipset With Lead Solder Balls $289.95 |
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5X NEW NVIDIA G84-600-A2 BGA chipset With Lead free Solder Balls $289.95 |
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10x NEW NVIDIA MCP79MXT-B2 With Lead free Solder Balls (ship from US) $279.95 |
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10X NEW AMD 216-0809000 BGA chipset With Lead free Solder Balls $279.50 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball ROHS $249.10 |
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5X NEW NVIDIA G84-750-A2 BGA chipset With Lead free Solder Balls $269.95 |
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Assorted Lead free ROHS Solder ball BGA SGS Certified $236.65 |
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5X NEW NVIDIA G84-602-A2 BGA Chipset With Lead Free Solder Balls $249.95 |
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5X NEW NVIDIA MCP89MZ-A3 With Lead free Solder Balls $245.00 |
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5X NEW NVIDIA G84-602-A2 BGA Chipset With Lead Solder Balls $239.95 |
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5X NEW NVIDIA NB9P-GS-W2-C1 BGA chipset With Lead Free Solder Balls $239.00 |
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1X NEW NVIDIA MCP89UZ-A3 BGA Chipset With Lead free Solder Balls $233.95 |
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5X NEW NVIDIA G86-730-A2 BGA chipset With Lead free Solder Balls Ship from US $229.95 |
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10X NEW Intel BD82HM55 BGA Chipset With Lead Solder Balls $229.95 |
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10X NEW Intel BD82HM65 BGA Chipset With Lead Solder Balls $229.95 |
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5X NEW NVIDIA G86-750-A2 BGA chipset With Lead free Solder Balls $229.95 |
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1X NEW AMD RADEON IGP 216-0674022 BGA chipset With Lead free Solder Balls $223.95 |
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10X NEW AMD RADEON IGP 216-0674026 BGA chipset With Lead free Solder Balls $219.95 |
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10x NEW AMD 218-0792006 BGA chipset With Lead Solder Balls $219.95 |
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10X NEW ATI 216-0683013 BGA Chip With Lead Solder Balls $219.95 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball SGS $180.00 |
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0.3 0.35 0.4mm 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $180.00 |
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0.3 0.35 0.4 0.45 0.5mm 0.55 0.6mm 0.76 mm Solder ball $180.00 |
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0.3mm 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $180.00 |
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0.3 0.35mm 0.4 0.45mm 0.5 0.55 0.6 0.76 mm Solder ball $180.00 |
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10X NEW ATI Radeon Xpress X1600 216PLAKB24FG With Lead Solder Balls $199.95 |
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10X NEW ATI Radeon X1600 216PLAKB26FG With Lead Solder Balls $199.95 |
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5x NEW NVIDIA MCP89MZ-A2 With Lead free Solder Balls $199.95 |
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10x NEW AMD Radeon IGP 215-0674034 BGA chipset With Lead free Solder Balls $199.95 |
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10x NEW AMD Southbridge 218-0660017 BGA chipset With Lead free Solder Balls $199.95 |
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10x NEW AMD 218-0792008 BGA chipset With Lead Free Solder Balls $199.95 |
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10X NEW ATI 216-0683001216-0683001-00 BGA Chip With Lead Solder Balls $199.95 |
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10X NEW AMD 216MQA6AVA12FG BGA chipset With Lead Free Solder Balls $199.95 |
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10X NEW AMD 215NQA6AVA12FG BGA chipset With Lead Free Solder Balls $199.00 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball SGS $160.74 |
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0.3 0.35mm 0.4 0.45mm 0.5 0.55 0.6 0.76 mm Solder ball $160.74 |
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0.3 0.35 0.4 0.45 0.5mm 0.55 0.6mm 0.76 mm Solder ball $160.74 |
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0.3 0.35 0.4mm 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $160.74 |
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0.3mm 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $160.74 |
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5x NEW NVIDIA MCP79MXT-B3 With Lead free Solder Balls $189.95 |
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5X NEW NVIDIA MCP79MXD-B2 With Lead free Solder Balls $189.95 |
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5X NEW AMD 216-0810005 BGA chipset With Lead free Solder Balls $189.95 |
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5X NEW NVIDIA N11M-GE1-S-A3 BGA chipset With Lead free Solder Balls $184.95 |
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0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm Solder ball SGS $131.60 |
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250k 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm BGA Solder Balls Leaded Sphere $129.99 |
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10X NEW AMD RADEON IGP 216-0674024 BGA chipset With Lead free Solder Balls $159.95 |
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0.3mm 0.35 0.4 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $120.55 |
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0.3 0.35mm 0.4 0.45mm 0.5 0.55 0.6 0.76 mm Solder ball $120.55 |
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0.3 0.35 0.4 0.45 0.5mm 0.55 0.6mm 0.76 mm Solder ball $120.55 |
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0.3 0.35 0.4mm 0.45 0.5 0.55 0.6 0.76mm mm Solder ball $120.55 |
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8 bottles 250K BGA solder balls 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.76 mm leaded $149.99 |
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5X NEW Intel BD82HM57 BGA Chipset With Lead Solder Balls $149.95 |
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BGA reballing station+ 40 stencils + solder ball+ paste $113.90 |
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5x NEW NVIDIA MCP79MXT-B2 With Lead free Solder Balls (ship from US) $145.95 |
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5X NEW AMD 216-0809000 BGA chipset With Lead free Solder Balls $144.95 |
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10X NEW Intel NH82801HBM BGA Chipset With Lead free Solder Balls $139.95 |
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10X NEW Intel AF82801JIB BGA Chipset With Lead Solder Balls $139.95 |
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5X NEW ATI Radeon 216-0729042 With Lead Free Solder Balls $139.95 |
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100×100 BGA IC station + 0.5 0.6 0.76 mm stencil balls Solder Chipset $85.99 |
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10X NEW Intel AF82801IBM BGA Chipset With Lead free Solder Balls $135.95 |
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10X NEW AMD 216LQA6AVA12FG BGA chipset With Lead Free Solder Balls $135.95 |
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bga reballing stencil,219pcs/set,solder ball,paste,scraper,brush,shipping by DHL $130.00 |
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BGA hand grip Reballing station + template +solder ball $85.00 |
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5X NEW Intel BD82HM55 BGA Chipset With Lead Solder Balls $124.95 |
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5X NEW Intel BD82HM65 BGA Chipset With Lead Solder Balls $124.95 |
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bga reballing kit,bga tool for reballing,bga stencils 254pcs/set,solder ball… $120.00 |
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5x NEW AMD 218-0792006 BGA chipset With Lead Solder Balls $119.95 |
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5X NEW ATI 216-0683013 BGA Chip With Lead Solder Balls $119.95 |
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5X NEW AMD RADEON IGP 216-0674026 BGA chipset With Lead free Solder Balls $115.95 |
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5X NEW ATI 216-0683001216-0683001-00 BGA Chip With Lead Solder Balls $114.95 |
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bga reballing station,bga stencils 219pcs,solder paste,solder ball,ship by DHL $88.00 |
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NEW BGA reballing station+3 stencils +solder ball+paste $84.15 |
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New BGA Reball kits+3 0.5 0.6 0.76 stencils+solder ball $84.15 |
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BGA reballing stencils 10pcs universal,solder ball,solder paste, shipping by DHL $80.00 |
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5x NEW AMD Radeon IGP 215-0674034 BGA chipset With Lead free Solder Balls $109.95 |
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5x NEW AMD Southbridge 218-0660017 BGA chipset With Lead free Solder Balls $109.95 |
Solder Ball Questions
What Is BGA?
BGA stands for Ball Grid Array. A web definition from PrincetonUSA explains it as, “A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance. See CSP and FBGA”.
It is a form of packaging used for electronic circuits that are integrated and surface mounted. The integrated circuits contain components that are actually affixed or mounted to the board of the circuit semiconductor, which is printed. A package of BGA appears like a wafer thin material of semi conductor that contains on one of its faces, the circuit components. This package is named so due to in its basic form; it is an array of balls made of metal alloy arranged in a formation that resembles a grid. Further integrated circuit packaging includes the Pin Grid Array, or PGA. Both appear similar, as both of them are one sided, meaning one of its faces contains substrate for semi conducting, which is used for mounting and printing of the circuit components. The pattern that appears as a grid is also a similarity between them, with the PGA uses pins and the BGA utilizes balls.
BGA manufacture starts of with a printed and primed circuit board, where the pads which are made of copper are arranged in a grid appearing pattern. The solder balls are calculated to have these. Following the precise arrangement of the solder balls upon the printed face of the circuit board’s surface, the process of soldering begins. Mount soldering of the surface proceeds through to reflow soldering, using a reflow oven, which uses vapors or infrared as its heat source. The balls of metal alloy melt because of extreme temperatures, which lead to cooling afterwards. The solder balls then solidify and the package becomes affixed firmly to the circuit board.
BGA’s advantages make the precise mounting and alignment possible. Before BGA came about, single circuit boards required numerous pins, which presented problems in positioning. When the assembly heated up, pins facing each other sometimes soldered together, thereby forming unplanned bridges. Heat conduction is another advantage of BGA over the other packaging types. BGA contains less heat resistance, making it easier for heat to flow to the circuit board that is printed from the components of the mounted circuit. This reduces overheating risks considerably. BGA’s contact points, that is the contact point between the actual circuit board that is printed and the solder balls on the surface is not easily apparent. The actualization of this is greater application and data society.
Some disadvantages of integrated circuits that feature BGA packaging are somewhat inflexible. Rigorous strain upon the integrated circuit can cause the contact tips or the balls to sever off. Moreover, expensive tools would be needed to fix construction or design errors, should they be found.
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