Qfp Package
Todays deals on Qfp Package?
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MOTOROLA PART# MC68020FC16E qty:144 LOT IC QFP Package $990.00 |
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Approx.500 new INTEL S82451GX, PCI set, QFP package $348.51 |
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STM32-QFP64 STM32 Programming Adapter Test Socket for LQFP64 Package 0.5mm Pitch $77.99 |
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STM8-QFP32 STM8 Programming Adapter IC Test Socket for LQFP32 Package 0.8 Pitch $66.99 |
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STM8-QFP48 STM8 Programming Adapter IC Test Socket for LQFP48 Package 0.5 Pitch $59.99 |
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STM32-QFP48 STM32 Programming Adapter Test Socket for LQFP48 Package 0.5mm Pitch $59.99 |
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CPU MC68MH360FE33E MOTOROLA QFP Package MC68MH360F $49.95 |
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STM8-QFP44 STM8 Programming Adapter Test Socket for LQFP44 Package 0.8mm Pitch $53.99 |
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CPU XC68331FE Mot QFP PLCC type package Rare! $39.95 |
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CPU KU82961KD-20 Intel QFP PLCC type package $39.95 |
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CPU MC68EC000FU12 MOTOROLA QFP Package MC68EC000 $39.95 |
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CPU MC68340FE16C Mot QFP Package Rare! 68340FE NEW $29.95 |
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CPU MC68EC030FE25B MOTOROLA QFP Package MC68EC030F $29.95 |
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CPU MC68360FE33C MOTOROLA QFP Package MC68360F $29.95 |
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CPU MC68340FE25E MOTOROLA QFP Package MC68340F $24.95 |
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L1A9286 LSI 1995 QFP Package Rare! NEW $24.95 |
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CPU KU82395DX-25 Intel QFP Quad Flat Pack type package $19.95 |
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CPU MC68EC040FE25 MOTOROLA QFP Package MC68EC040F $19.95 |
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CPU MC68340FE16E MOTOROLA QFP Package MC68340F $19.95 |
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CPU MC68340FT16E MOTOROLA QFP Package MC68340F $19.95 |
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T6963C 0101 TOSHIBA QFP Package Rare! T6963 NEW $19.95 |
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4 new pieces, INTEL S82451GX, PCI set, QFP package $18.88 |
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iM4A5-192/96 LATTICE QFP Package 4A5-192/96-10VC NEW $14.95 |
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L1A7860 LSI LOGIC QFP Package NEW! $14.95 |
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CPU PS86D805 1XX2-0003 S3 QFP Package PS86D805 Bent $14.95 |
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CPU KU82395DX-33 Intel QFP PLCC type package $12.95 |
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NEC UPD71055GB QFP type package New! $9.95 |
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BCM5338MA2KQM broadcom 0349D/C QFP-208 package IC 1pce $8.00 |
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XCS30-3TQ144I XILINX 0509D/C QFP-144 package IC 1pce $7.00 |
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LXT9781HC LEVELONE 0345D/C QFP-208 package IC 1pce $6.00 |
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BCM5325MA2KQM broadcom 0410D/C QFP-128 package IC 1pce $3.50 |
Qfp Package Questions
Infineon scalable 8-bit microcontroller complete high-temperature (MCU) series
March 9, 2010, Neubiberg, Germany and New Zealand will be Castle News – The New York will be held at Fort embedded technology trade show in 2010, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the availability of scalable a full set of high-temperature 8-bit microcontroller (MCU) series. The series can be as high as 150 ° C operating environment to meet the automotive and industrial electronics industry’s most stringent standards. XC800150 ° C launched a new series can be applied without restriction temperature from -40 ° C to 150 ° C environment. This is expensive and complicated cooling and refrigeration system provides an efficient alternative, as well as poor working conditions in the application of micro-controller provides a feasible alternative.
XC800150 ° C series is ideal for automotive products, such as turbochargers, engine fans, throttle or valve control, EPS, fuel / fuel sensor, and water / oil / fuel pumps. Potential industrial applications including heating control devices, boiler system or the motor of the electronic control system.
Microcontroller Infineon Technologies AG Juergen Hoika marketing director, said: “Infineon is the world’s first application to provide unrestricted access to 150 ° C high temperature environment, in line with AEC-Q100 Grade-0 standards for the full set of 8 microcontroller products manufacturers. XC800 150 ° C series of products including flash memory, peripherals, innovations in the many different models, greatly facilitate the customers to select the appropriate application-specific embedded devices. “
AEC-Q100 automotive electronic equipment by the Commission (AEC) to develop standards of reliability stress tests. Tests show that launched a new series of high-temperature Infineon MCU, after meet AEC-Q100 Grade 0 (-40 ° C to 150 ° C) standards require testing and certification. This makes them a vehicle engine compartment, and the extremely harsh environment of industrial solutions ideal.
XC800150 ° C devices can be installed close to sensors and actuators, electronic or mechanical, compared with the previous solution, the connectivity can be improved to ensure efficient motor control, and reduce system cost. Since the devices do not need additional devices and wiring insulation, so automotive and industrial products help reduce the cost and complexity. XC800150 ° C series, all models are based on Infineon’s strong durability, performance, mature technology and high-quality flash memory production technology to ensure excellent reliability.
Equipped with powerful peripheral XC800 150 ° C series
XC800150 ° C series to further develop a mature, powerful XC800 microcontroller applications. The devices built an 8051 processor core, the different capacity of flash memory (4kB to 32kB), and integrated oscillator, voltage regulator, EEPROM and monitoring circuits and other components, can reduce overall system cost. XC800 different types of devices, is also equipped to support a variety of motor control and power conversion products, power peripherals. These peripherals include the flexibility to generate a PWM capture / compare unit (CCU6), an enhanced fast digital to analog converter (used to achieve accurate measurements, hardware synchronized to pulse width modulation), and contains two CAN nodes MultiCAN module . On-chip CAN lcm assembly XC800150 ° C micro-controller, through the provision of network protocols (CAN frames shielding, filtering and buffering) Most of the functionality required to reduce the CPU load. In addition, XC800150 ° C series also contains a 16-bit vector calculation unit, to support field-oriented motor control (FOC) calculation of the required triangle. The new devices are introduced using a variety of packages, including 24,28, and 38-pin T-SSOP package and 48-pin QFP packaging.
Availability
The first XC800 150 ° C device (24kB and 32kB Flash memory, support for field oriented control of the XC886 Grade 0) in the project has started to provide samples. The model is expected to be mass production in July 2010. Other models of the product line is expected to be launched in 2011.
More
Fort will be held in New Embedded Technology 2010 show (March 2, 2010 to 4), Infineon will be in the company’s booth (Hall 21, Booth 428) for embedded display high-temperature micro-controller-type products and other innovative devices.
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Qfp Package Videos
How to solder a small QFP package with normal soldering iron – part 1
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