Epitaxial Transistor


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1000 PCS 2SC3355 C3355 NPN SILICON EPITAXIAL TRANSISTOR /FREE Registered Mail


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2SC2904 NPN EPITAXIAL PLANAR TYPE (RF POWER TRANSISTOR) IC


2SC2904 NPN EPITAXIAL PLANAR TYPE (RF POWER TRANSISTOR) IC


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20 pcs PNP Epitaxial Transistor 2SA1931 A1931


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2000 SAMSUNG BC556B BC556-B  EPITAXIAL TRANSISTOR


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NPN Silicon Epitaxial Transistors TIP35C TO-3P 40pcs


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20 PNP Epitaxial Planar Silicon Transistor 2SB817 B817


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2SC3240 NPN EPITAXIAL PLANAR TYPE (RF POWER TRANSISTOR) IC


2SC3240 NPN EPITAXIAL PLANAR TYPE (RF POWER TRANSISTOR) IC


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200 pcs PNP Epitaxial Transistor 2SA965 A965 TO-92MOD


200 pcs PNP Epitaxial Transistor 2SA965 A965 TO-92MOD


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100 pcs PNP Epitaxial Planar Transistor 2SA1208 A1208


100 pcs PNP Epitaxial Planar Transistor 2SA1208 A1208


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200pc PNP Epitaxial Planer Transistor 2SA719 A719 TO-92


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200 pcs NPN Epitaxial Planar Transistor 2SC535C C535C


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100 pcs PNP Epitaxial Transistor 2SA1358 A1358 Toshiba


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50 pcs NPN Epitaxial Transistor 2SC4793  C4793


50 pcs NPN Epitaxial Transistor 2SC4793 C4793


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2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


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200 pcs NPN Epitaxial Transistor 2SC2458 C2458 TO-92


200 pcs NPN Epitaxial Transistor 2SC2458 C2458 TO-92


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100 PCS KTC3882 SOT-23 EPITAXIAL PLANAR NPN TRANSISTOR


100 PCS KTC3882 SOT-23 EPITAXIAL PLANAR NPN TRANSISTOR


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500 PCS 2SC2655 TO-92L C2655 Silicon NPN Epitaxial Type


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1000 PCS 2SC1623-L7 SOT-23 C1623 L7 NPN Epitaxial Transistor


1000 PCS 2SC1623-L7 SOT-23 C1623 L7 NPN Epitaxial Transistor


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10 pcs NPN Epitaxial Transistor 2SC5200 C5200 TO-264


10 pcs NPN Epitaxial Transistor 2SC5200 C5200 TO-264


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500 PCS 2SD965-R TO-92 2SD965 D965-R D965 Silicon NPN epitaxial planar type


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1000 PCS 2SC1623-L6 SOT-23 C1623 L6 SMD NPN Epitaxial Transistor


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NPN Silicon Epitaxial Transistors 2SD2499 TO-3P 20pcs


NPN Silicon Epitaxial Transistors 2SD2499 TO-3P 20pcs


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2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


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200 pcs PNP Epitaxial  Transistor 2SA844 A844 TO-92


200 pcs PNP Epitaxial Transistor 2SA844 A844 TO-92


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2SC5125 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE (RF


2SC5125 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE (RF


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100 PNP epitaxial planer Transistor 2SA684 A684 TO-92L


100 PNP epitaxial planer Transistor 2SA684 A684 TO-92L


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200 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


200 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


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50 pcs PNP Epitaxial Transistor 2SA1145  A1145 TO-92MOD


50 pcs PNP Epitaxial Transistor 2SA1145 A1145 TO-92MOD


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2SC2097 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE(for


2SC2097 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE(for


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400 PCS 2SC2655-Y TO-92L 2SC2655Y C2655Y C2655 Silicon NPN Epitaxial Type


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2SC2694 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE (RF


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200pcs PNP Epitaxial Silicon Transistor 2N5401 TO-92MOD


200pcs PNP Epitaxial Silicon Transistor 2N5401 TO-92MOD


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2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


2SC2904 RF TRANSISTOR MITSUBIS NPN EPITAXIAL PLANAR TYPE RF P


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NEW 100 Lot KEC 2A 50V Epitaxial Planar PNP Transistors  KTA1281-Y-AT YK115


NEW 100 Lot KEC 2A 50V Epitaxial Planar PNP Transistors KTA1281-Y-AT YK115


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200 SAMSUNG KSP2222A-TA NPN EPITAXIAL Si TRANSISTORS


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MJE170 Plastic PNP Epitaxial Silicon Tr  LOT OF 20


MJE170 Plastic PNP Epitaxial Silicon Tr LOT OF 20


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2SD1609 / D1609 Silicon NPN Epitaxial Transistor LOT


2SD1609 / D1609 Silicon NPN Epitaxial Transistor LOT


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KSE803 / NPN EPITAXIAL SILICON TRANSISTOR 10 pc LOT


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120 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


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10 pcs NPN Epitaxial silicon Transistor BU406 TO-200


10 pcs NPN Epitaxial silicon Transistor BU406 TO-200


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10 pcs NPN Epitaxial silicon Transistor BU406 TO-200


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100 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


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2SB1143 PNP epitaxial planar 50V/4A  swi LOT OF 10


2SB1143 PNP epitaxial planar 50V/4A swi LOT OF 10


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100pcs Epitaxial Transistor 2SC2458 C2458 TO-92


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NPN Silicon Epitaxial Transistors 2SC3320 TO-3P 8pcs


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200 pcs PNP Epitaxial Silicon Transistor 2N3906 TO-92


200 pcs PNP Epitaxial Silicon Transistor 2N3906 TO-92


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5 pcs of MA177 Silicon epitaxial planar type Transistor IC


5 pcs of MA177 Silicon epitaxial planar type Transistor IC


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10PCS 2SC1973  TRANSISTOR NPN EPITAXIAL PLANAR


10PCS 2SC1973 TRANSISTOR NPN EPITAXIAL PLANAR


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New 2SB1156 B1156 Silicon PNP epitaxial planar type Transistor


New 2SB1156 B1156 Silicon PNP epitaxial planar type Transistor


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2SC3022 Manu:MITSUBIS  Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE


2SC3022 Manu:MITSUBIS Encapsulation:RF TRANSISTOR,NPN EPITAXIAL PLANAR TYPE


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BUX23 NPN MULTI EPITAXIAL POWER TRANSISTOR


BUX23 NPN MULTI EPITAXIAL POWER TRANSISTOR


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BUX23B  NPN MULTI EPITAXIAL POWER TRANSISTOR


BUX23B NPN MULTI EPITAXIAL POWER TRANSISTOR


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200 PCS 2SC1623-L6 SOT-23 C1623 NPN Epitaxial Transistor NEW


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BDX63B - NPN EPITAXIAL BASE DARLINGTON POWER TRANSISTOR


BDX63B – NPN EPITAXIAL BASE DARLINGTON POWER TRANSISTOR


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NPN SILICON EPITAXIAL DIFFUSED TRANSISTOR 2SC1426 ( NEW )


NPN SILICON EPITAXIAL DIFFUSED TRANSISTOR 2SC1426 ( NEW )


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100 PCS 2SB647 B647 TO-92L Silicon PNP Epitaxial


100 PCS 2SB647 B647 TO-92L Silicon PNP Epitaxial


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100 PCS 2SB647AC TO-92L 2SB647 B647AC B647 Silicon PNP Epitaxial


100 PCS 2SB647AC TO-92L 2SB647 B647AC B647 Silicon PNP Epitaxial


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SILICON NPN EPITAXIAL PLANAR TYPE TRANSISTOR 2SC2509 ( NEW )


SILICON NPN EPITAXIAL PLANAR TYPE TRANSISTOR 2SC2509 ( NEW )


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2SC959 -  C959 PNP/NPN SILICON EPITAXIAL TRANSISTOR IC


2SC959 – C959 PNP/NPN SILICON EPITAXIAL TRANSISTOR IC


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2SC1454 NPN EPITAXIAL SILICON TRANSISTOR


2SC1454 NPN EPITAXIAL SILICON TRANSISTOR


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BSS60  SILICON PLANAR EPITAXIAL TRANSISTOR


BSS60 SILICON PLANAR EPITAXIAL TRANSISTOR


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2 pcs KTA1659A - KTA1659 EPITAXIAL PLANAR PNP TRANSISTOR IC


2 pcs KTA1659A – KTA1659 EPITAXIAL PLANAR PNP TRANSISTOR IC


$7.52


Silicon PNP epitaxial planar type Darlington Transistor 2SB1492 ( NEW )


Silicon PNP epitaxial planar type Darlington Transistor 2SB1492 ( NEW )


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2SC1947 NPN EPITAXIAL PLANAR TYPE 1PCS


2SC1947 NPN EPITAXIAL PLANAR TYPE 1PCS


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New 2SC1454 C1454 NPN EPITAXIAL SILICON Transistor


New 2SC1454 C1454 NPN EPITAXIAL SILICON Transistor


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100, PNP Epitaxial Silicon 2N3906-338 3906 Transistor


100, PNP Epitaxial Silicon 2N3906-338 3906 Transistor


$11.99


2SA1850 ORIGINAL SANYO PNP EPITAXIAL PLANAR SILICON TRANSISTOR BRAND NEW


2SA1850 ORIGINAL SANYO PNP EPITAXIAL PLANAR SILICON TRANSISTOR BRAND NEW


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Silicon PNP epitaxial planer transistor UN4111 - 5 PCS


Silicon PNP epitaxial planer transistor UN4111 – 5 PCS


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2SC943 NPN SILICON EPITAXIAL TRANSISTOR IC


2SC943 NPN SILICON EPITAXIAL TRANSISTOR IC


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Lot of 4 NJS BSX60 Transistors NOS Silicon Planar Epitaxial


Lot of 4 NJS BSX60 Transistors NOS Silicon Planar Epitaxial


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50 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


50 PCS 2SD667AC TO-92L 2SD667A 2SD667 D667AC D667 Silicon NPN Epitaxial


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100 PCS 2SA1013 Y TO-92L A1013 Silicon PNP Epitaxial Type (PCT Process)


100 PCS 2SA1013 Y TO-92L A1013 Silicon PNP Epitaxial Type (PCT Process)


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12PCS KTC3882 HF SOT-23 EPITAXIAL PLANAR NPN TRANSISTOR


12PCS KTC3882 HF SOT-23 EPITAXIAL PLANAR NPN TRANSISTOR


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SANYO 2SB1143 LOT of FIVE - 50V/4A EPITAXIAL TRANSISTOR


SANYO 2SB1143 LOT of FIVE – 50V/4A EPITAXIAL TRANSISTOR


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NPN EPITAXIAL PLANAR TYPE(RF POWER TRANSISTOR) 2SC2538 ( NEW )


NPN EPITAXIAL PLANAR TYPE(RF POWER TRANSISTOR) 2SC2538 ( NEW )


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Silicon PNP Epitaxial Planar Transistor,SANKEN 2SA1215 Mt200 -160v -4A 150w BCE


Silicon PNP Epitaxial Planar Transistor,SANKEN 2SA1215 Mt200 -160v -4A 150w BCE


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BDX18 60V PNP silicon transistor epitaxial base BY SGS


BDX18 60V PNP silicon transistor epitaxial base BY SGS


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2pcs PNP Epitaxial Transistor 2SA1931 A1931


2pcs PNP Epitaxial Transistor 2SA1931 A1931


$5.50


2SC3668 NPN EPITAXIAL TYPE (POWER AMPLIFIER, Transistor


2SC3668 NPN EPITAXIAL TYPE (POWER AMPLIFIER, Transistor


$4.45


10 TIP122 TO-220 NPN Epitaxial Darlington Transistor


10 TIP122 TO-220 NPN Epitaxial Darlington Transistor


$10.35


10 TIP127 TO-220 PNP Epitaxial Darlington Transistor


10 TIP127 TO-220 PNP Epitaxial Darlington Transistor


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2SD288 NPN EPITAXIAL SILICON TRANSISTOR x 2pcs per lot


2SD288 NPN EPITAXIAL SILICON TRANSISTOR x 2pcs per lot


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100 PCS 2SC2655 TO-92L C2655 Silicon NPN Epitaxial Type


100 PCS 2SC2655 TO-92L C2655 Silicon NPN Epitaxial Type


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BFY84 Manu:MOT  Encapsulation:CAN,SILICON PLANAR EPITAXIAL NPN TRANSISTOR


BFY84 Manu:MOT Encapsulation:CAN,SILICON PLANAR EPITAXIAL NPN TRANSISTOR


$6.00


2SC2634 PANASONIC SILICON NPN EPITAXIAL PLANAR TRANS


2SC2634 PANASONIC SILICON NPN EPITAXIAL PLANAR TRANS


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Epitaxial Transistor Questions

Epitaxial Transistor

Fundamentals of Semiconductor C-V Measurements

A Universal Test
Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies can also be characterized with C-V measure­ments, including bipolar junction transistors (BJTs), JFETs, III-V compound devices, photovoltaic cells, MEMs devices, organic TFT displays, photodiodes, carbon nano­tubes (CNTs), and many others.

The fundamental nature of these meas­urements makes them useful in a wide range of applications and disciplines. They are used in the research labs of universities and semiconductor manufacturers to evalu­ate new materials, processes, devices, and circuits. C-V measurements are extremely important to product and yield enhancement engineers, who are responsible for improv­ing processes and device performance. Reliability engineers use these measure­ments to qualify material suppliers, monitor process parameters, and analyze failure mechanisms.

With appropriate methodologies, instru­mentation, and software, a multitude of semiconductor device and material parame­ters can be derived. This information is used all along the production chain beginning with evaluation of epitaxially grown crys­tals, including parameters such as average doping concentration, doping profiles, and carrier lifetimes. In wafer processes, C-V measurements can reveal oxide thickness, oxide charges, mobile ions (contamination), and interface trap density. These measure­ments continue to be used after other process steps, such as lithography, etching, cleaning, dielectric and polysilicon depositions, and metallization. After devices are fully fabri­cated on the wafer, C-V is used to character­ize threshold voltages and other parameters during reliability and basic device testing and to model the performance of these devices.

The Physics of Semiconductor Capacitance
A MOSCAP structure is a fundamental device formed during semiconductor fabri­cation. Although these devices may be used in actual circuits, they are typi­cally integrated into fabrication processes as a test structure. Since they are simple struc­tures and their fabrication is easy to control, they are a convenient way to evaluate the underlying processes.

The metal/polysilicon layer is one plate of the capacitor, and silicon dioxide is the insulator. Since the substrate below the insulating layer is a semiconducting material, it is not by itself the other plate of the capacitor. In effect, the majority charge carriers become the other plate. Physically, capacitance, C, is deter­mined from the variables in the following equation:

C = A (κ/d), where

A is the area of the capacitor,

κ is the dielectric constant of the insulator, and

d is the separation of the two plates.

Therefore, the larger A and κ are, and the thinner the insulator is, the higher the capacitance will be. Typically, semiconduc­tor capacitance values range from nanofar­ads to picofarads, or smaller.

The procedure for taking C-V measure­ments involves the application of DC bias voltages across the capacitor while mak­ing the measurements with an AC signal. Commonly, AC frequencies from about 10kHz to 10MHz are used for these measurements. The bias is applied as a DC voltage sweep that drives the MOSCAP structure from its accumulation region into the depletion region, and then into inversion

A strong DC bias causes majority car­riers in the substrate to accumulate near the insulator interface. Since they can’t get through the insulating layer, capacitance is at a maximum in the accumulation region as the charges stack up near that interface (i.e., d is at a minimum). One of the fundamental parameters that can be derived from C-V accumulation measurements is the silicon dioxide thick­ness, tox.

As bias voltage is decreased, majority carriers get pushed away from the oxide interface and the depletion region forms. When the bias voltage is reversed, charge carriers move the greatest distance from the oxide layer, and capacitance is at a minimum (i.e., d is at a maximum). From this inversion region capacitance, the number of majority carriers can be derived. The same basic concepts apply to MOSFET transistors, even though their physical structure and dop­ing is more complex.

Many other parameters can be derived from the three regions as the bias voltage is swept through them. Different AC signal frequencies can reveal additional details. Low frequen­cies reveal what are called quasistatic characteristics, whereas high frequency testing is more indicative of dynamic performance. Both types of C-V testing are often required.

Basic Test Setup
Because C-V measurements are actually made at AC frequencies, the capacitance for the device under test (DUT) is calculated with the following:

CDUT = IDUT / 2πfVAC, where

IDUT is the magnitude of the AC current through the DUT,

f is the test frequency, and

VAC is the magnitude and phase angle of the measured AC voltage

In other words, the test measures the AC impedance of the DUT by applying an AC voltage and measuring the resulting AC current, AC voltage, and impedance phase angle between them.

These measurements take into account series and parallel resist­ance associated with the capacitance, as well as the dissipation factor (leakage).

Challenges to Successful C-V Measurements
Certain challenges are associated with this testing. Typically, test personnel have problems in the following areas:

Low capacitance measurements (picofarads and smaller values)

C-V instrument connections (through a prober) to the • wafer device

Leaky (high D) capacitance measurements

Using hardware and software to acquire the data

Parameter extractions

Overcoming these challenges requires careful attention to the techniques used along with appropriate hardware and software.

Low Capacitance Measurements. If C is small, the DUT’s AC response current is small and hard to measure. However, at higher frequencies, the DUT impedance is reduced, so the current increases and is easier to measure. Often semiconductor capacitance is very low (less than 1pF), which is below the capabilities of many LCR meters. Even those claiming to measure these small capacitance val­ues may have confusing specifications that make it difficult to deter­mine the final accuracy in the measurement. If accuracy over the instrument’s full measurement range is not explicitly stated, the user needs to clarify this with the manufacturer.

High D (Leaky) Capacitors. In addition to having a low C value, a semiconductor capacitor may also be leaky. That is the case when the equivalent R in parallel with C is too low. This results in resis­tive impedance overwhelming the capacitive impedance, and the C value gets lost in the noise. For devices with ultra-thin oxide layers, D values can be greater than five. In general, as D increases, the accu­racy of a C measurement is rapidly degraded, so high D is a limiting factor in the practical use of a C meter. Again, higher frequencies can help solve the problem. At higher frequencies the capacitive impedance is lower, resulting in a C current that is higher and more easily measured.

C-V Measurement Connections. In most test environments, the DUT is a test structure on a wafer: It is connected to the C-V instru­ment through a prober, a probe card adapter, and a switch matrix. Even if no switch is involved, there is still a prober and significant cabling. At high frequencies, special cor­rections and compensation must be applied. Usually, this is achieved with some combina­tion of an open, short, or calibration device. Because of the complexity of the hardware, cabling, and compensation techniques, it is a good idea to confer with C-V test application engineers. They are skilled at working with various probe systems to overcome many types of interconnection problems.

Obtaining Useful Data. In addition to the accuracy issues mentioned earlier, practical considerations in C-V data collection include the instrumentation’s range of test variables, versatility of parameter extraction software, and ease of hardware usage. Traditionally, C-V testing has been limited to about 30V and 10mA DC bias. However, many appli­cations, such as characterizing LD MOS structures, low-kinterlayer dielectrics, MEMs devices, organic TFT displays, and photodiodes, require tests at higher voltage or current. For these applications, a separate high voltage DC power supply and C meter are required; DC bias up to 400V differen­tial (0 to ±400V) and a current output up to 300mA are very useful. Being able to apply differential DC bias on both the HI and LO terminals of the C-V instrument offers more flexible control over electric fields within the DUT, which is very helpful in the research and modeling of novel devices, such as nano­scale components.

The instrumentation software should include ready-to-run test routines that do not require user programming. These should be available for the most widely used device technologies and test regimens, which were mentioned in the first three paragraphs of this article. Some researchers may also be interested in less common tests, such as performing both a C‑V and C‑f sweep on a Metal‑Insulator‑Metal (MIM) capacitor, measuring small interconnect capacitance on a wafer, or doing a C‑V sweep on a two-terminal nanowire device. The parameter extractions should be easily obtained, with automated curve plotting.

Often, engineers and researchers are expected to perform C-V measurements with little experience and training on the instrumentation. A test system with an intui­tive user interface and easy-to-use features makes this practical. That includes simple test setup, sequence control, and data analy­sis. Otherwise, the user spends more time learning the system than collecting and using the data. Other considerations are a test system with:

  • Tightly integrated source-measure units, digital oscilloscope and C-V meter
  • Easy integration with other external  instruments
  • High resolution and precise measure­ments at the probe tips (DC biasing down to millivolts and capacitance measure­ments down to femtofarads)
  • Test setups and libraries that can be eas­ily modified
  • Diagnostic/troubleshooting tools that let users know whether or not the system is performing correctly.

About the Author

Lee Stauffer is the Senior Staff Technologist for Keithley Instruments’ Semiconductor Measurements Group, based in Cleveland, Ohio. Prior to joining Keithley, his career included designing satellite communication systems, as well as equipment and product engineering in semiconductor fabs. Keithley designs, develops, manufactures and markets complex electronic instruments and systems geared to the specialized needs of electronics manufacturers for high-performance production testing, process monitoring, product development and research.

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